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MCM C/Mixed Technologies and Thick Film Sensors

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Proceedings of the NATO Advanced Research Workshop on `Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994


Titel: MCM C/Mixed Technologies and Thick Film Sensors
Autoren/Herausgeber: W.K. Jones, Karel Kurzweil, Gabor Harsányi, Sylvia Mergui (Hrsg.)
Aus der Reihe: NATO Science Partnership Sub-Series: 3
Ausgabe: 1995

ISBN/EAN: 9780792334606

Seitenzahl: 318
Format: 23,5 x 15,5 cm
Produktform: Hardcover/Gebunden
Gewicht: 1,420 g
Sprache: Englisch

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. - Newsletter
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