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Nanopackaging

Nanotechnologies and Electronics Packaging

von
Springer US,
Buch
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Kurzbeschreibung

This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, and industrial electronics packaging engineers.

Details
Schlagworte
Hauptbeschreibung

Titel: Nanopackaging
Autoren/Herausgeber: James E. Morris (Hrsg.)
Ausgabe: 2008

ISBN/EAN: 9781441942906

Seitenzahl: 543
Format: 23,5 x 15,5 cm
Produktform: Taschenbuch/Softcover
Gewicht: 866 g
Sprache: Englisch

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

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